[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[H.R. 6058 Introduced in House (IH)]
<DOC>
119th CONGRESS
1st Session
H. R. 6058
To provide for multilateral semiconductor technology supply chain
coordination, and for other purposes.
_______________________________________________________________________
IN THE HOUSE OF REPRESENTATIVES
November 17, 2025
Mr. Huizenga (for himself, Mr. Moylan, and Mr. Crenshaw) introduced the
following bill; which was referred to the Committee on Foreign Affairs
_______________________________________________________________________
A BILL
To provide for multilateral semiconductor technology supply chain
coordination, and for other purposes.
Be it enacted by the Senate and House of Representatives of the
United States of America in Congress assembled,
SECTION 1. SHORT TITLE.
This Act may be cited as the ``Semiconductor Technology Resilience,
Integrity, and Defense Enhancement Act'' or the ``STRIDE Act''.
SEC. 2. SENSE OF CONGRESS.
It is the sense of Congress that--
(1) the global semiconductor technology supply chain is
critical to United States and allied national security,
economic competitiveness, and technological leadership;
(2) the Chinese Communist Party is pursuing strategies to
dominate the semiconductor technology industry to assist in its
military modernization efforts and human rights abuses through
non-market practices, export control violation and avoidance,
economic espionage, military-civil fusion, and predatory
investment;
(3) the integrity of the global semiconductor technology
supply chain requires coordinated action with allied and
partner nations to prevent technological capture by the Chinese
Communist Party and other foreign adversaries;
(4) unilateral export controls for protecting critical
semiconductor technologies can be amplified with multilateral
coordination; and
(5) fully utilizing certain unilateral United States export
control authorities, including the Foreign Direct Product Rule,
has proven effective at preventing circumvention or avoidance
of United States export controls through third-country
production.
SEC. 3. STATEMENT OF POLICY.
It is the policy of the United States to--
(1) maintain United States and allied partner technological
leadership in semiconductor technology research, design,
manufacturing, and advanced materials;
(2) prevent adversarial capture of key chokepoints in the
global semiconductor technology supply chain;
(3) coordinate with allied and partner nations to expand
and enhance semiconductor technology protection;
(4) ensure that United States-origin technology and
intellectual property, including the direct products of United
States-origin technology, do not contribute to the Chinese
Communist Party's military modernization, human rights abuses,
and pursuit of technological dominance over the United States
and its allies and partners; and
(5) promote resilient, secure, and trusted semiconductor
supply chains among United States allies and partners.
SEC. 4. MULTILATERAL SEMICONDUCTOR TECHNOLOGY SUPPLY CHAIN
COORDINATION.
(a) In General.--The Secretary of State shall coordinate with
governments of countries that maintain significant capabilities in
semiconductor technology research, design, manufacturing, materials,
equipment, or equipment subsystems and components to establish
coordinated and expanded approaches for protecting critical
semiconductor technologies from acquisition by the Chinese Communist
Party and other foreign adversaries of the United States and its allies
and partners.
(b) Coordination Objectives.--In carrying out subsection (a), the
Secretary of State shall seek to achieve--
(1) alignment of export control policies regarding
semiconductor technology manufacturing equipment, including
lithography systems, deposition equipment, etching tools,
thermocompression bonding equipment, resist processing tools,
chemical mechanical planarization tools, cleaning tools,
handling tools, assembly, packaging, and test tools, and
inspection systems and the critical subcomponents needed to
produce such equipment;
(2) expanded restrictions on semiconductor technology
design tools, intellectual property transfers, equipment
servicing, and technical assistance that could enable
indigenous semiconductor technology development capabilities in
countries of concern;
(3) harmonized approaches to controlling dual-use
semiconductor technology materials, including photoresists,
specialty gases, and advanced substrates;
(4) joint monitoring, enforcement, and administration
mechanisms to prevent circumvention of semiconductor technology
controls through third-country entities as well as prevent
foreign backfilling of restricted items;
(5) information sharing regarding semiconductor technology
transfer risks, end-user verification, and supply chain
security threats; and
(6) establishment of trusted supplier networks for critical
semiconductor technology components and manufacturing services.
(c) Consequences for Non-Cooperation.--
(1) Assessment of cooperation.--The Secretary of State, in
consultation with the Secretary of Commerce, shall regularly
assess the extent to which countries engaged pursuant to
subsection (a) are implementing measures consistent with United
States policy described in section 3.
(2) Determination of insufficient security measures.--If
the Secretary of State determines that a country engaged with
pursuant to subsection (a) is not implementing security
measures sufficient to fully prevent semiconductor technology
transfer to countries of concern, the Secretary shall--
(A) provide a detailed explanation of the specific
deficiencies in the country's semiconductor technology
protection measures;
(B) request the Secretary of Commerce to convene a
meeting of the Export Advisory Review Board to identify
and execute a plan of action to address the
insufficient security measures within 21 days of the
Secretary of State's determination of inadequate
cooperation; and
(C) notify the appropriate congressional committees
of such determination not later than 30 days after
making such determination and provide routine updates
on the Export Advisory Review Board meeting request and
plan of action described in subparagraph (B).
(3) Enhanced foreign direct product rule application.--In
carrying out the process described in paragraph (2)(B), the
Secretary of State shall provide to Export Advisory Review
Board--
(A) recommendations for the application of Foreign
Direct Product Rule restrictions to semiconductor
technology produced in the non-cooperating country that
incorporate United States-origin technology, software,
or equipment;
(B) recommended entities for the expansion of
Entity List designations for semiconductor technology
supply chain companies or research institutions in the
non-cooperating country that pose technology transfer
risks; and
(C) guidance on what additional steps may be needed
to prevent foreign backfilling of U.S. technology in
restricted sectors or entities in countries of concern.
(d) Reports.--
(1) In general.--Not later than 90 days after the date of
enactment of this Act, and every 90 days thereafter, the
Secretary of State shall submit to the appropriate
congressional committees a report on--
(A) the status of diplomatic engagement with key
semiconductor technology-producing countries;
(B) progress toward achieving the coordination
objectives specified in subsection (b);
(C) any determinations of inadequate cooperation
made under subsection (c); and
(D) the effectiveness of multilateral coordination
in preventing semiconductor technology transfer to
countries of concern.
(2) Form.--The report required by this subsection shall be
submitted in unclassified form but may include a classified
annex.
(e) Definitions.--In this section:
(1) Appropriate congressional committees.--The term
``appropriate congressional committees'' means--
(A) the Committee on Foreign Affairs of the House
of Representatives; and
(B) the Committee on Foreign Relations and the
Committee on Banking, Housing, and Urban Affairs of the
Senate.
(2) Countries of concern.--The term ``countries of
concern'' has the meaning given the term ``covered nation'' in
section 4872(f) of title 10, United States Code.
(3) Entity list.--The term ``Entity List'' means the list
maintained by the Bureau of Industry and Security of the
Department of Commerce and set forth in Supplement No. 4 to
part 744 of title 15, Code of Federal Regulations, or successor
regulations.
(4) Foreign direct product rule.--The term ``Foreign Direct
Product Rule'' means the rule exercising United States export
controls on an item produced in a foreign country for shipment
or transmission to another foreign country or foreign person,
if the item--
(A) is produced using technology or software that
is otherwise subject to the jurisdiction of the United
States;
(B) is produced with the use of a plant or major
component of a plant that--
(i) is located outside the United States;
and
(ii) has been created using the technology
or software described in subparagraph (A); or
(C) contains, is commingled with, is bundled with,
is drawn from, or is produced by an item described in
subparagraph (A) or (B).
(5) Semiconductor technology.--The term ``semiconductor
technology'' includes--
(A) integrated circuits, microprocessors, and
memory devices;
(B) semiconductor manufacturing equipment and
tools, including subsystems and components;
(C) semiconductor design software and intellectual
property;
(D) semiconductor materials and specialty
chemicals;
(E) testing, assembly, and packaging equipment; and
(F) any technology, component, or service that is
essential to semiconductor design, manufacturing, or
testing processes.
<all>