DEPARTMENTS OF LABOR, HEALTH AND HUMAN SERVICES, AND EDUCATION, AND RELATED AGENCIES APPROPRIATIONS ACT, 2020; Congressional Record Vol. 165, No. 103
(Extensions of Remarks - June 19, 2019)
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[Extensions of Remarks]
[Page E797]
From the Congressional Record Online through the Government Publishing Office [www.gpo.gov]
DEPARTMENTS OF LABOR, HEALTH AND HUMAN SERVICES, AND EDUCATION, AND
RELATED AGENCIES APPROPRIATIONS ACT, 2020
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speech of
HON. DARREN SOTO
of florida
in the house of representatives
Wednesday, June 12, 2019
The House in Committee of the Whole House on the state of
the Union had under consideration the bill (H.R. 2740) making
appropriations for the Departments of Labor, Health and Human
Services, and Education, and related agencies for the fiscal
year ending September 30, 2020, and for other purposes:
Mr. SOTO. Mr. Chair, I would like to acknowledge that Division C of
H.R. 2740, the Defense Appropriations Act for FY 2020's Committee
Report, H. Rept. 116-84, provided an additional $10 million general
program increase in funding for the Industrial Base Analysis and
Sustainment Support Program within the Research, Development, Test and
Evaluation, Defense-Wide Account. These funds will allow the Department
of Defense to leverage existing public-private-partnerships to
establish a U.S. based manufacturing development platform for advanced
microelectronic system integration, including foundational copper-based
silicon interposer technology.
The Industrial Base Analysis and Sustainment Program is dedicated to
ensuring that the Department of Defense is positioned to more
effectively, and efficiently, address industrial base issues, and
support the National Security Innovation Base. This includes the
ability to proactively mitigate supply chain vulnerabilities within the
global defense industrial base, and to cultivate next generation,
emerging, defense manufacturing and technology sectors.
Continued U.S. global leadership in microelectronics depends on U.S.
owned firms operating at the leading edge of advanced logic
technologies and digital memories. The next generation of electronic
devices will require significantly greater functional density, in other
words, packing functional components together even more tightly than
current technology allows. This requires technical leadership in
microelectronics system integration, specifically in the
microelectronics manufacturing areas of integrating heterogeneous
devices, stacking memory, logic processing, sensors, communications,
and packaging with security and advanced interconnect methods.
One of the foundational technologies required for advanced system
integration is copper-based silicon interposer technology. This
foundational interposer technology can enable almost any
microelectronic dependent, or internet of things, system. However,
advanced system integration capabilities have moved offshore due to
cost, and there currently is no domestic sources that can reliably
serve the low volumes of advanced microelectronics that the Department
of Defense requires.
That is why there is a need for the Industrial Base Analysis and
Sustainment Support Program to leverage existing public-private-
partnerships to establish a U.S. based manufacturing development
platform for advanced microelectronic system integration, including the
foundational copper-based silicon interposer technology. This funding
increase will help to accomplish this, and I thank the Chairman for the
general program increase of $10 million for the Industrial Base
Analysis and Sustainment Support Program within the Research,
Development, Test and Evaluation, Defense-Wide Account.
I support the rapid modernization of domestic state-of-the-art
foundry operations that produce trusted microelectronics and thank the
Chairman and the Committee for all their work on the issue.
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